One-click full automatic bundling: drilling, feeding tube, cutting tube, loading tube, positioning, pressing riveting process all automated finished.

Parameters teknis
Power: 220V±5%V 50Hz
Drill: φ7x50mm hollow special drill
Method of bonding: Nylon tube heating high temperature bonding
Kapasitet: 1 ~ 50mm thickness (≤75g/㎡ paper)
Pressure riveting: ≤36V (safety voltage)
Power consumption: Maximum power 400W Minimum power 10w
Lɔ̈ɔ̈ŋ: Lɔ̈ɔ̈ŋ ye 9 seconds Lɔ̈ɔ̈ŋ ye 30 seconds
Warm Time: 4 ~ 6 minit
Dɛɛr: 440mm x 200mm
Kɔɔr: 40kg

Alarm kɔrɔ

A cɔl paper chip alarm detection alarm system, a cɔl machine durability, a cɔl chip removal system.

FUNCTIONAL FULL

Panel de luɔɔi ye tɔ̈u në luɔɔi de kä ye kek tɔ̈u në luɔɔi de kä ye kek tɔ̈u në luɔɔi de kä ye kek tɔ̈u në luɔɔi de kä ye kek tɔ̈u në luɔɔi de kä ye kek tɔ̈u në luɔɔi de kä ye kek

A fɛɛr yam

Design yam ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l ye kɛ̈l

Luɔi thiin

One-click full automatic bundling: drilling, feeding tube, cutting tube, loading tube, positioning, pressing riveting process all automated finished.

Garanti gël

Luɔ̈ɔ̈i de käke kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈

Temperature control ye kalkal

MCU ye tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ