Jinding Gemstone Saw Machine Technical Parameters

Saw Machine NameGH350(Gemstone sawing machine)

Cutting single crystal silicon maximum diameter Φ300mm
Minimum thickness of cutting monocrystalline silicon (Minimum thickness of cutting monocrystalline silicon) (Minimum thickness of cutting monocrystalline silicon) (Minimum thickness of cutting monocrystalline silicon)1mm
Saw Wheel Diameter Φ400mm
Saw Wheel Speed 0～1500rpm
Saw Wheel Motor Power 4Kw
Saw band specifications:(Length × Width × Thickness) 3230×38×0.5mm
Cutting feed speed 0～20mm/min
Lɔ̈ɔ̈m Maximum 500mm
Saw blade Tension Mechanical, pressure sensor gël
Kontrol Computer Control, Touch Screen Operation
Main belt wheel radial beating ≤0.02mm
Linearity of motion of cutting rail ≤0.01/ 100mm
Linearity of movement of feed rail (Linearity of movement of feed rail) ≤0.02/100mm
Cutting section surface roughnessRa≤3.2um
Largest cut-off width of workpiece ≤0.7mm
Maximum cutting length of workpiece 500mm