8 temperature zone microcycle reflow welding equipment structure diagram

8 Temperature Zone Microcycle Reflow Welding Equipment Performance Features
● Ka bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i Ka tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ
● High quality high temperature high speed motor is smooth running wind, vibration small, noise low. ● High quality high temperature high speed motor is smooth running wind, vibration small, noise low. ● High quality high temperature high speed motor is smooth running wind, vibration small, noise low. ● High quality high temperature high speed
● Professional wind wheel design, wind speed stable, effectively prevent the uniformity of wind when PCB board is heated, achieve high repeated heating. ● Professional wind wheel design, wind speed stable, effectively prevent the uniformity of wind when PCB board is heated, achieve high repeated heating. ● Professional wind wheel design, wind speed stable, effectively prevent the uniformity of wind when PCB board is heat
● Tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ
● UPS ye tɔ̈ɔ̈u në internet, ye tɔ̈ɔ̈u bï PCB board bɛ̈n ya tɔ̈ɔ̈u ka tɔ̈ɔ̈u ka tɔ̈ɔ̈u ka tɔ̈ɔ̈u ka tɔ̈ɔ̈u.
● Cooling system ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l; PCB board tɛmɛ ≤50 ℃;
● Thermal insulation layer adopts high quality aluminum silicate insulation material, multi-layer insulation furnace design, furnace coating surface temperature is about 5 degrees higher than ambient temperature, effectively reduces working environment temperature, insulation effect good, heating fast, from room temperature to working temperature≤20min. ● Thermal insulation layer adopts high quality aluminum silicate insulation material, multi-layer insulation furnace design, furnace coating surface temperature is about 5 degrees higher than ambient temperature, effectively reduces working environment temperature, insulation effect A cɔl special furnace bile design, a tɛ̈n yenë riɛl ya tɔ̈ɔ̈u thïn;
| Proyek | Specifications Model |
| Sistem Kontrol | PC+PLC/Single Chip Machine |
| Warm/cooling zone | 16 ɣän ye kɔrɔ̈ɔ̈ŋ / ɣän ye kɔrɔ̈ɔ̈ŋ / ɣän ye kɔrɔ̈ɔ̈ŋ / ɣän ye kɔrɔ̈ɔ̈ŋ |
| Longitude de zone de chauffage | 2800mm |
| Temperature control range | Ɣön tɛmɛ ~ 350 ℃ |
| Temperature Control Precision | ±1~2 ℃ |
| 3 point temperature difference | ±2℃ |
| Cooling Method | Fɛɛr ye cɔl air cooling/2 independent cooling zones |
| PCB size | 30 ~ 350mm |
| PCB transfer height | 900±20mm |
| Wɛ̈t tɔ̈u | Chain rail + network belt transfer |
| Yɔɔr | 左→右 |
| Speed transfer | 0 ~ 2000 mm / min |
| Range of chain rail | 30~350 mm |
| Bandwidth de réseau de transmission | 400 mm |
| Power | A3ø380V 50HZ |
| Puɔth ye luui/Puɔth ye luui | 10.8/50KW |
| Kɔɔr (L*W*H) | 5200mm ((L) *1400mm ((W) *1500mm ((H) |
| Net Weight | 1250KG |
